e e - - p p h h e e m m t t m m m m i i c c a a e e 3 3 1 1 2 2 (preliminary) product features application ? small size ? higher gain ? higher linearity ? sot89 smd type package ? higher productivity ? lower manufacturing cost ? -62dbc cso 135 channels @ +15dbmv/ch ? -74dbc ctb 135 channels @ +15dbmv/ch ? -87dbc xmd 135 channels @ +15dbmv/ch ? low noise amplifier for catv, satellite ? cable modem ? ftth (g-pon, ge-pon) ? optical node description AE312 is designed as low cost driv e amplifiers for many applicati ons including ftth, catv system. this mmic is based on gallium arsenide enhancement mode phemt which shows low current draw and very low noise. the data in this spec sheet is valid only for 75 ohm app lication. 50 ohm data is in a separate spec sheet. specifications package : sot-89 parameter unit min typ max condition frequency mhz 50 ~ 1000 gain db 18 20 input return loss db -15 output return loss db -18 output ip3 dbm 29 32 at 500mhz/5dbm 2tone 1db compression point dbm 16 19 at 500mhz noise figure db 1 2 cso dbc -62 -57 135 channel, +15dbmv/ch ctb 30 ~ 870mhz dbc -74 -69 135 channel, +15dbmv/ch xmod dbc -87 -82 135 channel, +15dbmv/ch dc current ma 50 vdd = 5.0v note 1. test conditions unless otherwis e noted. test freq = 500mhz, t=25 , vdd=5v, 75 ? system 2. oip3 measured with 2 tones at an output power of +5dbm/tone separated by 1mhz, test freq = 500mhz absolute minimum and maximum ratings parameter unit min typ max device voltage vdc +5 +5.5 operating temperature -40 +85 storage temperature -40 +150 ? tel : 82-31-250-5011 ? all specifications may change without notice. ? rfsales@rfhic.com ? version 0.3
e e - - p p h h e e m m t t m m m m i i c c a a e e 3 3 1 1 2 2 (preliminary) application circuit: 50mhz ~ 1000mhz, 75ohm system typical rf performance: v dd =5v, i ds =50ma, t=25 , 75ohm system noise figure vs frequency 0 1 2 3 4 5 10 200 400 600 800 1000 freq(mhz) nf(db) 0.20.40.60.81.0 0.0 1.2 5 10 15 20 0 25 -20 -10 0 10 -30 20 freq(ghz) gain(db) return loss(db) s-parameter s21 s1 1 s22 multi-t o ne t e st 135ch_fla t @output pow e r +15dbmv/ch leve l: + 1 5dbm v tilt: 135ch_fl a t frq xmd(ncta) ctb_ raw ctb_ cor n-flr csu_ raw csu_ cor csu_ frq csl_ raw csl_ cor csl_ frq 55. 2 5 88. 8 72. 8 77. 1 7 3 . 1 72. 1 76. 4 5 6 62. 2 6 2 . 6 5 4 77. 2 5 88. 9 73. 1 77. 5 7 3 . 6 6 3 63. 5 77. 9 9 72. 9 7 7 . 2 76. 5 5 10 9. 25 87. 9 72. 9 77. 3 7 3 . 1 72. 6 76. 9 1 1 0 . 3 3 63. 3 6 3 . 8 1 0 7 . 9 9 21 1. 25 90. 7 72. 2 76. 5 7 2 . 6 70. 7 75. 1 2 1 2 . 5 64. 5 6 5 . 1 2 0 9 . 9 9 33 1. 25 90. 6 71. 7 7 6 7 1 . 9 69. 2 72. 2 3 3 2 . 5 6 4 6 4 . 7 3 2 9 . 9 9 44 5. 25 9 0 72. 6 76. 9 7 2 . 9 69. 3 71. 5 4 4 6 . 4 9 66. 3 6 7 . 3 4 4 4 54 7. 25 91. 6 71. 5 75. 9 7 1 . 7 67. 5 69. 4 5 4 8 . 5 66. 3 6 7 . 7 5 4 5 . 9 9 63 7. 25 9 0 71. 3 75. 7 7 1 . 6 67. 1 68. 8 6 3 8 . 4 9 68. 3 7 0 . 9 6 3 5 . 9 9 74 5. 25 92. 1 71. 2 75. 5 7 1 . 6 66. 5 68. 2 7 4 6 . 4 9 70. 4 7 4 . 7 7 4 3 . 9 9 85 9. 25 91. 6 7 0 74. 3 7 0 . 2 65. 9 68. 1 8 6 0 . 4 9 69. 9 7 4 . 3 8 5 8 . 2 8 mi n 87. 9 7 0 74. 3 7 0 . 2 6 3 63. 5 5 6 62. 2 6 2 . 6 5 4 m ax 92. 1 73. 1 77. 5 7 3 . 6 72. 6 76. 9 8 6 0 . 4 9 72. 9 7 7 . 2 8 5 8 . 2 8 ? t e l : 82- 31- 250- 5 0 1 1 ? all specifications m a y change witho u t notice. ? rfsales@ rfhic.com ? v e r s ion 0. 3
e e - - p p h h e e m m t t m m m m i i c c a a e e 3 3 1 1 2 2 (preliminary) esd protection for a safe use in all situations, it is recommended to have proper esd control techniques while the device is being handled. here are some recommended precautions; - person at a workbench should be earthed via a wrist strap and a resistor. - all mains-powered equipment should be connect ed to the mains via an earth-leakage switch. - equipment cases should be grounded. - relative humidity should be maintained between 40% and 50%. - an ionizer is recommended. - keep static materials, such as plastic envelopes and plastic trays etc. away from the workbench dimensions pin no function 1 input 2 ground 3 output/bias 4 ground pcb pad layout recommended mounting configuration mounting configuration notes 1.ground / thermal via holes are critical for the proper performance of this device. 2. add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. mounting screws can be added near the part to fasten the board to a heatsink. ensure that the ground / thermal via hole regi on contacts the heatsink. 4. do not put solder mask on the backside of the p cb in the region where the board contacts the heatsink. 5. rf trace width depends upon th e pcb material and construction. 6. use 1 oz. copper minimum. 7. all dimensions are in millimeters. ? tel : 82-31-250-5011 ? all specifications may change without notice. ? rfsales@rfhic.com ? version 0.3 rfhic corporation (rfhic) reserves the right to make changes to any products herein or to discontinue any product at any time w ithout notice. rfhic do not assume any liability for the suitability of its products for any particular purpose, and disclaims any and all liability, inclu ding without limitation consequential or incidental damages. the product specifications herein expressed have been carefully checked and are assumed to be reliable. how ever, rfhic disclaims liability for inaccuracies and strongly recommends buyers to verify that the information they are using is current before placing purchase or ders. rfhic products are not intended for use in life support equipment or application where ma lfunction of the product can be expected to result in persona l injury or death. buyer uses or sells such products for any such unintended or unauthorized applicatio n, buyer shall indemnify, protect and hold rfhic and its direct ors, officers, stockholders, employees, representatives and distributors harmless against any a nd all claims arising out of such use. rfhic?s liability unde r or arising out of damages, claims of whatsoever kind and nature which rfhic p roducts could cause shall be limited in amount to the net p urchase p rice of the p roducts sold to bu y er b y rfhic .
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